Recycled epoxy hardener resin from waste plastics

With 30 years of expertise in composite materials, the R&D team of Swancor has developed EzCiclo, a low dielectric epoxy resin hardener for PCBS. This hardener is made from over 80% of waste plastics while retaining the performance of traditional commercially available hardeners. When applied to PCBS, this low dielectric hardener can enhance the electrical properties of FR4 boards made of epoxy resin After curing, the pure resin can reach Dk-2.78/Df-0.011 at 10GHz, increasing the recyclable material content of the PCB. This can simultaneously achieve the goals of waste reduction and carbon reduction. This material can be applied to any product that uses PCB, including general electronic products, automotive or network communication products, etc.

The highlights of this technology include the preparation of active ester oligomers from waste plastics through chemical treatment, which serve as hardeners for epoxy resins. After curing with epoxy resin, it has good electrical properties and is degradable. After formula and pressure plate tests by the Industrial Technology Research Institute, copper foil substrates that comply with standards such as IPC-4101E/21, IPC-4101/122, and IPC-4101/125 can be prepared. It has been verified that the pressed copper foil substrate can be chemically treated to degrade and separate the copper foil from the glass fiber cloth.

2 Low dielectric bio-based BMI resin
The R&D team of Swancor has also developed bismaleimide resin prepared from bio-based raw materials, available in two specifications with bio-based content of 42% and 67%, which have carbon reduction benefits. The electrical performance of the 42% bio-based content cured product at 10GHz is Dk=2.54, Df=0.0044, and the DMA analysis shows that the Tg is approximately 188℃. The electrical performance of the 67% bio-based content cured product at 10GHz is Dk=2.22, Df=0.0027, and the DMA analysis shows that the Tg is approximately 91℃. It can be used as a low dielectric co-curing additive; It has good flexibility and can improve the toughness of rigid circuit boards and RCC backed adhesive copper foil materials.
These two innovative materials from Swancor offer the PCB industry high-value, low-carbon new competitiveness and can serve as solutions for transformation strategies and specific actions.